Chipfilm_Logo

Veröffentlichungen

H. Rempp, Joachim N. Burghartz, C. Harendt, N. Pricopi, M. Pritschow, C. Reuter, H. Richter, I. Schindler, M. Zimmermann
Link show Ultra-Thin Chips on Foil for Flexible Electronics

Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International, February 3 - 7, 2008, 334-617, February, (2008)


Nicoleta Wacker, H. Rempp, S. Schmiel, J. N. Burghartz
PDF show Accurate Measurement of Piezocoefficients in CMOS Transistors on Conventional and Ultra-Thin Silicon Chips
11th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE), Veldhoven, The Netherlands, November 26 - 27, 2008, Poster, Published in Proceedings of SAFE 2008, Technology and Materials, 605-608, STW Technology Foundation, November 27, 2008,
ISBN: 978-90-73461-56-7, Kompletter Konferenzband am IMS vorhanden, (2008)


Joachim N. Burghartz, W. Appel, H. Rempp, M. Zimmerman
PDF showA New Fabrication and Assembly Process for Ultrathin Chips
IEEE Transactions on Electron Devices, Volume: 56, Number: 2, pp. 321-327, February, 2009, (2009)


Harald Richter, H. Rempp, M. Hassan, C. Harendt, N. Wacker, M. Zimmermann, J. N. Burghartz,
Link showTechnology and design aspects of ultra-thin silicon chips for bendable electronics
IEEE International Conference on IC Design and Technology. ICICDT '09., Austin, TX USA, May 18 - 20, 2009, Vortrag,
Published in Proceedings of IEEE, Conference Proceeding, Volume: 2009, 149 - 154, IEEE, July 17, 2009,
ISBN: 978-1-4244-2933-2, Kompletter Konferenzband am IMS vorhanden, (2009)


Joachim N. Burghartz, W.Appel, C. Harendt, H. Rempp, M. Zimmermann
Ultra-thin Chips - a New Paradigm in Silicon Technology
Proc. of ESSDERC 2009, pp.29-36,2009


Joachim N. Burghartz, N.Wacker, M. Hassan, H. Rempp, H. Richter
MOST Modeling for Ultra-Thin Flexible Electronics
MOS-AK workshop on compact modelling, (ESSDERC-ESCIRC 2009. Athens)


Nicoleta Wacker, M. Hassan, H. Richter, H. Rempp, J. N. Burghartz
PDF showCompact Modeling of CMOS Transistors under Uniaxial Stress
12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE), Veldhoven, The Netherlands,
Velthoven, November 26 - 27, 2009, Poster, Published in Proceedings of SAFE 2009, Technology and Materials,
STW Technology Foundation, 179-181, November 27, 2009, (2009)


Mahadi-Ul Hassan, H. Rempp, T. Hoang, H. Richter, N. Wacker, J. N. Burghartz
PDF showAnomalous Stress Effects in Ultra-Thin Silicon Chips on Foil
Baltimore, Maryland, USA, December 7 - 9, 2009, Vortrag, Published in Proceedings of IEEE, Electron Devices Meeting (IEDM),
2009 IEEE International , 535-538, IEEE, December 7, 2009, ISBN: 978-1-4244-5640-6,


Astrid Kiss, T. Hoang, C. Harendt, J. N. Burghartz
Investigation of Mechanical Strength of Epitaxially Grown Ultra-Thin Silicon Chips
12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE), Veldhoven, The Netherlands,
November 26 - 27, 2009, Vortrag, pp. 85-90, November 27, 2009, Kompletter Konferenzband am IMS vorhanden, (2009)


Joachim N. Burghartz, C. Harendt, T. Hoang, A. Kiss, , M. Zimmermann
Ultra-Thin Chip Fabrication for Next-Generation Silicon Processes
Proc. Bipolar/BiCMOS Circuits and Technology Meeting. 2009. pp. 131-137


Evangelos A. Angelopoulos, M. Wiesner, S. Ferwana, J. N. Burghartz
Compliant Substrate based on Sintered Porous Silicon for the Local Integration of Heterodevices
with Silicon Microelectronics

39th European Solid-State Device Research Conference (ESSDERC 2009), Athens, Greece,
September 14 - 18, 2009, Poster, September 14, 2009, (2009)

O.Tobail
Porous Silicon for Thin Solar Cell Fabrication
Ph.D. thesis, Institut für Physikalische Elektronik (ipe), Universität Stuttgart, (2008)

O.Tobail, M. Reuter, J. H. Werner
PDF showOrigin of the Open Circuit Voltage Limit for Transfer Solar Cell
in Proc. 24th European Photovoltaic Solar Energy Conference, Germany,
edited by W. C. Sinke, H. A. Ossenbrink, P. Helm (2009), p. 2593-2595


Martin Zimmermann, J. N. Burghartz, W. Appel, N. Remmers, C. Burwick, R. Würz, O. Tobail, M. Schubert, G. Palfinger, J. H. Werner
PDF showA Seamless Ultra-Thin Chip Fabrication and Assembly Process
Published in Proceedings of Technical Digest of the International Electron Devices Meeting (IEDM), pp. 1010-1012, December, 2006, (2006)



getAcrobat